Palomar Technologies makes the connected world possible by delivering a Total Process Solution for advanced photonic and microelectronic device assembly processes utilized in todays smart, connected devices. With a focus on flexibility, speed and accuracy, Palomars Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved quality and yield, reduced assembly times, and rapid ROI.